Reducing relative intermodule motion in a modular implantable medical device
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United States of America Patent
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Jun 24, 2008
Grant Date -
Sep 9, 2004
app pub date -
Dec 9, 2003
filing date -
Dec 9, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A modular implantable medical device includes a plurality of modules that are at least partially encapsulated by an overmold. The modules may be connected by coupling modules, which may be flexible to provide for one or more degrees of relative intermodular motion. The overmold may also be flexible. In order to reduce relative intermodule motion to acceptable direction and/or ranges, the overmold may include one or more motion reduction elements.
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