US Patent No: 7,392,583

Number of patents in Portfolio can not be more than 2000

Securing solid-matrix panels for cutting using a tooling fixture

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ALSO PUBLISHED AS: 20050122128
ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

Tooling fixtures and methods are described for securing a solid-matrix panel for cutting. In one embodiment, a tooling fixture includes a first clamping system and a second clamping system. The first clamping system receives a solid-matrix panel of PCBs and secures the solid-matrix panel for cutting of the solid-matrix panel along a first axis. Once secured, a cutting apparatus cuts the solid-matrix panel along the first axis between the PCBs to cut the solid-matrix panel into a plurality of strips. The second clamping system then moves into a position relative to the strips of the solid-matrix panel and secures the strips for cutting of the strips along a second axis. When secured by the second clamping system, the cutting apparatus cuts the individual PCBs from the strips.

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First Claim

Related Publications

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Patent Owner(s)

Patent OwnerAddressTotal Patents
PMJ AUTOMEC USA, INC., D/B/A PMJ CENCORP, INC.LONGMONT, CO2

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Byers, Carl Raymond Longmont, CO 1 1
Casto, Dion Joe Parker, TX 1 1
Duck, Allen W Fort Collins, CO 2 3
Groves, Travis Wayne Johnstown, CO 2 3
Hill, Kurt John Berthoud, CO 6 19
Williams, Bob Allen Wheat Ridge, CO 2 3

Cited Art

Patent Info (Count) # Cites Year
 
PMJ CENCORP LLC (4)
4,742,615 Routing method and apparatus for cutting printed circuit boards 15 1986
5,117,554 Tab routing method and apparatus 9 1991
5,438,740 Reconfigurable fixturing pallet for registering and supporting multi-board panels on the table of a programmable routing machine 24 1994
5,894,648 High speed depaneling apparatus and method 11 1996
 
MICRON TECHNOLOGY, INC. (2)
6,047,470 Singulation methods 9 1997
6,508,154 Integrated circuit package separators 4 2000
 
CENCORP (1)
4,683,789 Method and apparatus for separating printed circuit boards from multi-board panels 11 1986
 
FREESCALE SEMICONDUCTOR, INC. (1)
6,150,240 Method and apparatus for singulating semiconductor devices 21 1998
 
ISHII TOOL & ENGINEERING CORPORATION (1)
6,671,940 Method and apparatus for manufacturing electronic parts 6 2001
 
NEU DYNAMICS CORP. (1)
5,839,337 Semiconductor carrier strip trimming apparatus 15 1996

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD. (1)
7,891,280 Method for cutting PCB 0 2008

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jan 1, 2016
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jan 1, 2020
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00