(Meth)acrylate-terminated polyphenylene ether
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United States of America Patent
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Jul 1, 2008
Grant Date -
Feb 7, 2008
app pub date -
Aug 17, 2007
filing date -
Jan 28, 2002
priority date (Note) -
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Abstract
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
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