Preformed sensor housings and methods to produce thin metal diaphragms
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United States of America Patent
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Jul 8, 2008
Grant Date -
May 15, 2008
app pub date -
Oct 23, 2006
filing date -
Jan 13, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A preformed sensor housing including a conduit having an inside; a plug disposed within the conduit; and a deposit covering a portion of the plug and a portion of the conduit. A method is also disclosed for creating a thin film diaphragm on a housing including the step of inserting a sacrificial element into the housing; depositing a diaphragm material onto the sacrificial element and the housing; and removing the sacrificial element.
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