System and method for optimizing wafer flatness at high rotational speeds
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 8, 2008
Grant Date -
N/A
app pub date -
Sep 28, 2004
filing date -
Sep 28, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention is a chuck having a vacuum groove that is capable of holding a wafer as the chuck rotates on a spindle. As the chuck rotates the air pressure above the center of the wafer is reduced. In order to reduce the bowing of the wafer that can result from this low pressure area above the wafer, the present invention introduces venturi holes in the chuck which reduces the air pressure in the area below the wafer. In order to prevent the air pressure in the area below the wafer from decreasing too far, the present invention uses air inlet holes to balance the affect of the venturi holes in order to substantially balance the air pressure above and below the wafer which results in significantly less bowing of the wafer when compared to conventional systems. The present invention accomplishes this without requiring sensors or other active measuring devices to help reduce the bowing of the wafer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully