Method of forming stepped structures employing imprint lithography

United States of America Patent

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Jul 8, 2008
Grant Date
Oct 28, 2004
app pub date
Apr 25, 2003
filing date
Apr 25, 2003

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Abstract

The present invention provides a method for forming a stepped structure on a substrate that features transferring, into the substrate, an inverse shape of the stepped structure disposed on the substrate.

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Patent Owner	Address
CITIBANK N A	388 GREENWICH STREET NEW YORK NY 10013

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Sreenivasan, Sidlgata V	Austin, TX	214	5594

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Method of forming stepped structures employing imprint lithography

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United States of America Patent

10423642

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PATENT NO	7396475
APP PUB NO	20040211754A1
SERIAL NO	10423642
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
July 08, 2008	US,7396475,B2 US7396475B2	GRANTED PATENT AS SECOND PUBLICATION
October 28, 2004	US,20040211754,A1 US20040211754A1	FIRST PUBLISHED PATENT APPLICATION

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10423642

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