Method and Device for forming an ink-receptive card substrate
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United States of America Patent
Stats
-
Jul 15, 2008
Grant Date -
Apr 6, 2006
app pub date -
Dec 5, 2005
filing date -
Mar 5, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In a method of forming an ink-receptive card substrate, an ink-receptive material is provided. The ink-receptive material includes a backing layer and an ink-receptive coating on a surface of the backing layer. Next, a card member is provided. Finally, the ink-receptive material is laminated to a surface of the card member with the ink-receptive coating facing the surface of the card member. This results in the bonding of the ink-receptive coating to the surface of the card member. Additional embodiments of the present invention are directed to devices that are configured to perform the above-identified method.
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