Method for making an integrated circuit substrate having embedded back-side access conductors and vias
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United States of America Patent
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Jul 15, 2008
Grant Date -
Feb 24, 2005
app pub date -
Sep 22, 2004
filing date -
May 1, 2002
priority date (Note) -
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Abstract
A method for making an integrated circuit substrate having embedded back-side access conductors and vias provides a high-density mounting and interconnect structure for integrated circuits that is compatible with etched, plated or printed pre-manufactured substrate components. A circuit board or film having a pre-plated, etched or printed circuit, for example a rigid substrate having a Ball Grid Array (BGA) ball-attach pattern, is laser perforated to produce blind vias and/or conductive patterns that provide contact through to conductors of the prefabricated circuit board or film. Existing circuit board and substrate technology is thereby made compatible with laser-embedding technologies, providing the low-cost advantages of existing etching, plating and printing technologies along with a high conductor density associated with laser-embedded circuit technologies.
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