US Patent No: 7,402,254
Number of patents in Portfolio can not be more than 2000
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
Stats
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Jul 22, 2008
Issued date -
Sep 8, 2003
filing date -
10/657,483
serial no -
In Force
status
Importance
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Abstract
A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.
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First Claim
Related Publications
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International Classification(s)
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- [Patents Count]
Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 5,092,032 Manufacturing method for a multilayer printed circuit board | 55 | 1991 | |
| 5,200,026 Manufacturing method for multi-layer circuit boards | 34 | 1991 | |
| 5,435,480 Method for filling plated through holes | 41 | 1993 | |
| 6,378,201 Method for making a printed circuit board | 35 | 1995 | |
| 5,822,856 Manufacturing circuit board assemblies having filled vias | 160 | 1996 | |
| 6,059,579 Semiconductor structure interconnector and assembly | 14 | 1997 | |
| 5,984,691 Flexible circuitized interposer with apertured member and method for making same | 90 | 1998 | |
| 6,009,620 Method of making a printed circuit board having filled holes | 24 | 1998 | |
| 6,125,531 Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means | 8 | 1999 | |
| 6,291,779 Fine pitch circuitization with filled plated through holes | 22 | 1999 | |
| 6,426,011 Method of making a printed circuit board | 10 | 2000 | |
| 6,388,204 Composite laminate circuit structure and methods of interconnecting the same | 35 | 2000 | |
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| 5,322,593 Method for manufacturing polyimide multilayer wiring substrate | 20 | 1992 | |
| 5,271,150 Method for fabricating a ceramic multi-layer substrate | 37 | 1993 | |
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| 5,433,822 Method of manufacturing semiconductor device with copper core bumps | 27 | 1992 | |
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| 5,819,406 Method for forming an electrical circuit member | 44 | 1996 | |
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| 6,486,394 Process for producing connecting conductors | 28 | 1999 | |
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| 6,914,200 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof | 4 | 2004 | |
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| 6,015,520 Method for filling holes in printed wiring boards | 36 | 1997 | |
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| 6,376,052 Multilayer printed wiring board and its production process, resin composition for filling through-hole | 42 | 2000 | |
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| 6,440,641 Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates | 7 | 1998 | |
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| 5,719,354 Monolithic LCP polymer microelectronic wiring modules | 54 | 1994 | |
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| 5,920,123 Multichip module assembly having via contacts and method of making the same | 25 | 1997 | |
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| 4,249,302 Multilayer printed circuit board | 73 | 1978 | |
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| 5,220,135 Printed wiring board having shielding layer | 14 | 1990 | |
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| 4,783,722 Interboard connection terminal and method of manufacturing the same | 81 | 1987 | |
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| 7,080,446 Wiring board sheet and its manufacturing method, multilayer board and its manufacturing method | 15 | 2002 | |
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| 4,512,829 Process for producing printed circuit boards | 25 | 1984 | |
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| 5,135,606 Process for preparing electrical connecting member | 25 | 1990 | |
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| 5,591,353 Reduction of surface copper thickness on surface mount printed wire boards with copper plated through holes by the chemical planarization method | 18 | 1994 | |
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| 5,624,268 Electrical connectors using anisotropic conductive films | 66 | 1996 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jan 22, 2016 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 22, 2020 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |