Microelectronic imaging units and methods of manufacturing microelectronic imaging units
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United States of America Patent
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Jul 22, 2008
Grant Date -
Feb 2, 2006
app pub date -
Jul 28, 2004
filing date -
Jul 28, 2004
priority date (Note) -
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Abstract
Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated and electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member. The individual stand-offs include a portion between adjacent external contacts.
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