Molded integrated circuit package with exposed active area

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7402454
APP PUB NO 20070085222A1
SERIAL NO

11638853

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may comprise a flexible, compressible tape having pressure-sensitive adhesive, alone or with a rigid substrate support, or a compliant adhesive preferably applied only around a periphery of the die attach area. Deformation of the compliant die attachment under mold clamping pressure allows complete contact of the mold with the active area, preventing bleeding of the encapsulating material under the edge of a mold portion onto the active area.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
STMICROELECTRONICS, INC.CARROLLTON, TX1600

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hundt, Michael J Double Oak, TX 48 1041
Zhou, Tiao Irving, TX 24 199

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERCONNECT SYSTEMS, INC. (1)
* 6667439 Integrated circuit package including opening exposing portion of an IC 40 2001
 
DENSO CORPORATION (2)
5948991 Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip 60 1997
6300155 Method for producing semiconductor device by coating 6 2000
 
INTEL CORPORATION (1)
6734544 Integrated circuit package 5 2003
 
MICRON TECHNOLOGY, INC. (1)
6097098 Die interconnections using intermediate connection elements secured to the die face 70 1997
 
GOLDSTAR ELECTRON CO., LTD. (1)
5644169 Mold and method for manufacturing a package for a semiconductor chip and the package manufactured thereby 185 1996
 
TEXAS INSTRUMENTS INCORPORATED (1)
6489178 Method of fabricating a molded package for micromechanical devices 72 2001
 
ROHM CO., LTD. (1)
6160526 IC module and IC card 58 1999
 
MITSUBISHI DENKI KABUSHIKI KAISHA (2)
4894707 Semiconductor device having a light transparent window and a method of producing same 52 1988
5424249 Method of making mold-packaged pressure sensing semiconductor device 29 1993
 
INTELLECTUAL VENTURES II LLC (1)
5622873 Process for manufacturing a resin molded image pick-up semiconductor chip having a window 50 1995
 
EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V. (1)
5897338 Method for encapsulating an integrated semi-conductor circuit 119 1997
 
NIPPON STEEL CORPORATION (1)
5422163 Flexible substrate with projections to block resin flow 24 1993
 
AUSTRIA MIKRO SYSTEM INTERNATIONAL AG (1)
6395585 Method for housing sensors in a package 21 2001
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
5004206 Vehicle seat mounting structure 42 1990
 
STATS CHIPPAC PTE. LTE. (2)
* 7875967 Integrated circuit with step molded inner stacking module package in package system 0 2008
* 2009/0224,390 INTEGRATED CIRCUIT WITH STEP MOLDED INNER STACKING MODULE PACKAGE IN PACKAGE SYSTEM 3 2008
* Cited By Examiner

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