US Patent No: 7,402,454

Number of patents in Portfolio can not be more than 2000

Molded integrated circuit package with exposed active area

ALSO PUBLISHED AS: 20070085222

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Importance

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Abstract

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An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may comprise a flexible, compressible tape having pressure-sensitive adhesive, alone or with a rigid substrate support, or a compliant adhesive preferably applied only around a periphery of the die attach area. Deformation of the compliant die attachment under mold clamping pressure allows complete contact of the mold with the active area, preventing bleeding of the encapsulating material under the edge of a mold portion onto the active area.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
STMICROELECTRONICS, INC.CARROLLTON, TX1364

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hundt, Michael J Double Oak, TX 59 876
Zhou, Tiao Irving, TX 36 116

Cited Art Landscape

Patent Info (Count) # Cites Year
 
DENSO CORPORATION (2)
5,948,991 Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip 50 1997
6,300,155 Method for producing semiconductor device by coating 6 2000
 
MITSUBISHI DENKI KABUSHIKI KAISHA (2)
4,894,707 Semiconductor device having a light transparent window and a method of producing same 51 1988
5,424,249 Method of making mold-packaged pressure sensing semiconductor device 28 1993
 
AUSTRIA MIKRO SYSTEME INTERNATIONAL AKTIENGESELLSCHAFT (1)
6,395,585 Method for housing sensors in a package 19 2001
 
EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V. (1)
5,897,338 Method for encapsulating an integrated semi-conductor circuit 113 1997
 
Goldstar Electron Co., Ltd. (1)
5,644,169 Mold and method for manufacturing a package for a semiconductor chip and the package manufactured thereby 159 1996
 
INTEL CORPORATION (1)
6,734,544 Integrated circuit package 5 2003
 
INTELLECTUAL VENTURES II LLC (1)
5,622,873 Process for manufacturing a resin molded image pick-up semiconductor chip having a window 47 1995
 
INTERCONNECT SYSTEMS, INC. (1)
6,667,439 Integrated circuit package including opening exposing portion of an IC 31 2001
 
MICRON TECHNOLOGY, INC. (1)
6,097,098 Die interconnections using intermediate connection elements secured to the die face 63 1997
 
NIPPON STEEL CORPORATION (1)
5,422,163 Flexible substrate with projections to block resin flow 24 1993
 
ROHM CO., LTD. (1)
6,160,526 IC module and IC card 56 1999
 
TEXAS INSTRUMENTS INCORPORATED (1)
6,489,178 Method of fabricating a molded package for micromechanical devices 69 2001

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
STATS CHIPPAC LTD. (1)
7,875,967 Integrated circuit with step molded inner stacking module package in package system 0 2008
 
Other [Check patent profile for assignment information] (1)
5,004,206 Vehicle seat mounting structure 32 1990

Maintenance Fees

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7.5 Year Payment $3600.00 $1800.00 $900.00 Jan 22, 2016
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jan 22, 2020
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