Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus
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United States of America Patent
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Jul 22, 2008
Grant Date -
Jan 12, 2006
app pub date -
Jun 22, 2005
filing date -
Jul 12, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A dicing sheet which supports electronic-component aggregation with adhesive in the case of separating the electronic-component aggregation in which a plurality of electronic components are integrated, has a substrate and an adhesion layer which is formed at one surface side of the substrate, in which a concave portion is formed on a surface of the adhesion layer, and the concave portion is formed so that a convex shape member projected from an adhesion surface of the electronic-component aggregation which is adhered to the dicing sheet is inserted.
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