Optical sensor chip package
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United States of America Patent
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Jul 29, 2008
Grant Date -
Apr 26, 2007
app pub date -
Sep 14, 2005
filing date -
Sep 14, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.
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