Patterning of mechanical layer in MEMS to reduce stresses at supports
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United States of America Patent
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-
Jul 29, 2008
Grant Date -
Dec 6, 2007
app pub date -
Jun 1, 2006
filing date -
Jun 1, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of fabricating a MEMS device includes the formation of support posts having horizontal wing portions at the edges of the post. A mechanical layer is deposited over the support posts and portions of the mechanical layer overlying portions of the support post other than the horizontal wing portions are etched away. A resultant MEMS device includes a mechanical layer overlying at least a portion of the horizontal wing portions of the underlying support structures.
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