Photosensitive resin composition and process for the formation of hydrogel
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United States of America Patent
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Aug 5, 2008
Grant Date -
Feb 23, 2006
app pub date -
Nov 13, 2003
filing date -
Nov 14, 2002
priority date (Note) -
Expired
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Abstract
The photosensitive resin composition is composed of a poly((meth)acrylic acid)-based water-soluble photo-sensitive resin (A) having an acid value of 150 mgKOH/g or more on a solid basis; the resin (A) being formed of a ((meth)acrylic acid)-based polymer in which a compound represented by formula (1): ##STR00001## (wherein R.sup.1 represents H or Me; and R.sup.2 represents a liner or branched C2-C10 alkylene group) has been added to portions of the carboxylic groups, a photopolymerization initiator (B); and water (C).
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