Microelectronic assemblies having compliant layers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 5, 2008
Grant Date -
Nov 23, 2006
app pub date -
Jul 14, 2006
filing date -
Oct 31, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectronic assembly includes a microelectronic element such as a semiconductor chip or wafer having a first surface and contacts accessible at the first surface, a compliant layer overlying the first surface of the microelectronic element, and conductive protrusions overlying the compliant layer and projecting away from the first surface of the microelectronic element, wherein the conductive protrusions are electrically interconnected with the contacts of the microelectronic element. The conductive protrusions are movable relative to said microelectronic element.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully