Transferable micro spring structure
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United States of America Patent
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Aug 12, 2008
Grant Date -
Jun 23, 2005
app pub date -
Dec 19, 2003
filing date -
Dec 19, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for mounting the micro spring structures onto cables or contact structures includes forming a spring island having an 'upside-down' stress bias on a first release material layer or directly on a substrate, forming a second release material over at least a portion of the spring island, and then forming a base structure over the second release material layer. The micro spring structure is then transferred in an unreleased state, inverted such that the base structure contacts a surface of a selected apparatus, and then secured (e.g., using solder reflow techniques) such that the micro spring structure becomes attached to the apparatus. The spring structure is then released by etching or otherwise removing the release material layer(s).
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