Stamp for use in a lithographic process, method of manufacturing a stamp, and method of manufacturing a patterned layer on a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Aug 12, 2008
Grant Date -
Oct 4, 2001
app pub date -
Jan 12, 2001
filing date -
Feb 7, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The stamp (10) for a lithographic process, such as patterning a surface layer, of the invention has a stamp body (5) with at least a first recess (11) formed therein, which recess defines a first aperture (15) in the printing face (3) of the stamp (10). The first recess (11) narrows with increasing distance to the printing face, while any cross-section of the first recess, when perpendicularly projected on the printing face (3), will lie within the aperture (15). The printing face may comprise small (11, 12) and large apertures (13) as well as small surfaces (14) in between apertures, while it is nevertheless able to produce prints which are accurate replicas of the printing face. Even details on a submicron scale can be adequately printed. The stamp (10) can be manufactured by a method which comprises anisotropic etching of a first body to make a mold and replicating the mold in the printing face (3) of the stamp (10).
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