Leadless plastic chip carrier and method of fabricating same
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United States of America Patent
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Aug 12, 2008
Grant Date -
N/A
app pub date -
Sep 26, 2005
filing date -
Sep 26, 2005
priority date (Note) -
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Abstract
A process for fabricating a leadless plastic chip carrier includes providing a leadframe including a plurality of contacts circumscribing a void; fixing a heat sink to the contacts of the leadframe using an intermediate non-electrically conductive adhesive such that the heat sink spans the void; mounting a semiconductor die to the heat sink in the void; wire bonding ones of the contacts to the pads of the semiconductor die; encapsulating the semiconductor die and the wire bonds in a molding material and singulating the leadless plastic chip carrier.
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