Integrated circuit package with partially exposed contact pads and process for fabricating the same
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United States of America Patent
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Aug 12, 2008
Grant Date -
N/A
app pub date -
Jul 15, 2004
filing date -
Jun 14, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A process for fabricating an integrated circuit package includes: selectively etching a leadframe strip to define a die attach pad and at least one row of contact pads; mounting a semiconductor die to one side of the leadframe strip, on the die attach pad; wire bonding the semiconductor die to ones of the contact pads; releasably clamping the leadframe strip in a mold by releasably clamping the contact pads; molding in a molding compound to cover the semiconductor die, the wire bonds and a portion of the contact pads not covered by the clamping; releasing the leadframe strip from the mold; depositing a plurality of external contacts on the one side of the leadframe strip, on the contact pads, such that the external contacts protrude from the molding compound; mounting at least one of an active and a passive component to a second side of said leadframe strip; and singulating to provide the integrated circuit package.
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