Method of forming copper layers
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United States of America Patent
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-
Aug 19, 2008
Grant Date -
Mar 23, 2006
app pub date -
Nov 9, 2005
filing date -
Dec 28, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A programmable package with a fuse embedded therein, and fabrication method are provided. The fuse has first and second terminal ends joined by a central portion defining a fusible link. The ends include a portion of the first and second conductive layers, the central portion including a portion of the first conductive layer. The first layer may be electroless copper and the second layer may be electrolytic copper. The fuse may have a dog-bone or a bow tie shape. The method includes providing a substrate with a dielectric layer, and forming the fuse by depositing first conductive layer, forming and patterning second conductive layer over a portion of the first layer, and patterning first layer to form interconnects between areas of the second layer.
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