Liquid cooled heat sink with cold plate retention mechanism
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United States of America Patent
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-
Aug 19, 2008
Grant Date -
Aug 16, 2007
app pub date -
Dec 12, 2006
filing date -
Sep 8, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.
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