Procedure for positioning a through-hole in a substrate
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United States of America Patent
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Aug 26, 2008
Grant Date -
Feb 2, 2006
app pub date -
Jul 25, 2005
filing date -
Jul 28, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A method for forming openings of predetermined position in a substrate in the form of a printing stencil by means of a laser, wherein the substrate is positioned using a fixture means in the form of a tensioning frame. In the process, a shift in position of openings resulting from subsequent processing steps and leading to a changed state of stress of the substrate is prevented by first determining the coordinates of a central reference point. Then, the respective distances of the predetermined positions of the openings from this reference point are determined, and an order of priority is determined therefrom. This order of priority then forms the basis for a machining program, which controls the path of movement of the laser head and forms the openings in the substrate.
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