Method of making circuitized substrate
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United States of America Patent
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Aug 26, 2008
Grant Date -
Jun 22, 2006
app pub date -
Feb 9, 2006
filing date -
Mar 31, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A method of making a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.
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