Direct contact power transfer pad and method of making same
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United States of America Patent
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Aug 26, 2008
Grant Date -
Jun 30, 2005
app pub date -
Sep 20, 2004
filing date -
Sep 19, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one conducting element disposed on each of the conductive substrate sections; a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board.
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