Qualifying patterns, patterning processes, or patterning apparatus in the fabrication of microlithographic patterns
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United States of America Patent
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Aug 26, 2008
Grant Date -
May 13, 2004
app pub date -
Jul 15, 2003
filing date -
Jul 15, 2002
priority date (Note) -
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Abstract
Methods that include acquiring aerial images of a reticle for different values of a member of a set of lithographic variables are provided. One method also includes determining a presence of an anomaly in a design pattern of the reticle by comparing at least one pair of the aerial images corresponding to at least two of the different values. A different method includes comparing at least one pair of the aerial images corresponding to at least two of the different values and determining an area on the reticle where a lithography process using the reticle is most susceptible to failure based on the results of the comparison. Another embodiment includes determining a presence of transient repeating defects on the reticle by subtracting non-transient defects from the aerial images and comparing at least one pair of the aerial images corresponding to at least two of the different values.
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