Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment
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United States of America Patent
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Sep 2, 2008
Grant Date -
Nov 17, 2005
app pub date -
Jul 22, 2005
filing date -
Nov 27, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing a semiconductor device includes (a) fixing a cover onto a semiconductor substrate so as to place a surface of the cover that includes a portion defining a first opening, face to face on a surface of the semiconductor substrate that includes an electrode and (b) applying an adhesive to the inside of the first opening.
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