DBG system and method with adhesive layer severing
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United States of America Patent
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-
Sep 2, 2008
Grant Date -
Aug 24, 2006
app pub date -
Mar 13, 2006
filing date -
Mar 2, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An array of grooves (23) is formed in a first side (12) of a wafer (10) during a wafer processing method. A back grinding tape (16) is adhered to the first side. An amount of material is removed from the second side (20) of the wafer. An adhesive layer (30) is applied to the second side. Dicing tape (24) is applied to the adhesive layer to create a first wafer assembly (32). The first wafer assembly is supported on a support surface (34) with the dicing tape facing the support surface and the back grinding tape exposed. The back grinding tape is removed and the adhesive layer is severed through the array of grooves to create individually removable die (28).
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