Methods of fabricating interferometric modulators by selectively removing a material
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United States of America Patent
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Sep 2, 2008
Grant Date -
Apr 13, 2006
app pub date -
Mar 25, 2005
filing date -
Sep 27, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Methods for making MEMS devices such as interferometric modulators involve selectively removing a sacrificial portion of a material to form an internal cavity, leaving behind a remaining portion of the material to form a post structure. The material may be blanket deposited and selectively altered to define sacrificial portions that are selectively removable relative to the remaining portions. Alternatively, a material layer can be laterally recessed away from openings in a covering layer. These methods may be used to make unreleased and released interferometric modulators.
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