Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7422635
APP PUB NO 20050045102A1
SERIAL NO

10652461

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure suggests several systems and methods for batch processing of microfeature workpieces, e.g., semiconductor wafers or the like. One exemplary implementation provides a method of depositing a reaction product on each of a batch of workpieces positioned in a process chamber in a spaced-apart relationship. A first gas may be delivered to an elongate first delivery conduit that includes a plurality of outlets spaced along a length of the conduit. A first gas flow may be directed by the outlets to flow into at least one of the process spaces between adjacent workpieces along a first vector that is transverse to the direction in which the workpieces are spaced. A second gas may be delivered to an elongate second delivery conduit that also has outlets spaced along its length. A second gas flow of the second gas may be directed by the outlets to flow into the process spaces along a second vector that is transverse to the first direction.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INC8000 S FEDERAL WAY P O BOX 6 BOISE ID 83707-0006

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Basceri, Cem Boise, ID 325 10555
Beaman, Kevin L Boise, ID 46 1506
Breiner, Lyle D Meridian, ID 42 1612
Doan, Trung T Pflugerville, TX 253 14083
Kubista, David J Nampa, ID 21 1790
Ping, Er-Xuan Meridian, ID 224 3186
Weimer, Ronald A Boise, ID 113 2880
Zheng, Lingyi A Boise, ID 64 1826

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