Method and device for packaging a substrate
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United States of America Patent
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Sep 9, 2008
Grant Date -
Mar 30, 2006
app pub date -
Jan 28, 2005
filing date -
Sep 27, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.
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