Paper handling system materials exit path arrangement

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7427059
APP PUB NO 20060220307A1
SERIAL NO

11084396

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A materials handling system includes an insertion subsystem for inserting materials into envelopes to form mailpieces of a first type and mailpieces of a second type. The materials handling syatem also includes a first mailpiece transport path located downstream from the insertion subsystem and having a curved portion along which mailpieces of said first type are transported, and a second mailpiece transport path being substantially horizontal, located downstream from the insertion subsystem, and along which mailpieces of the second type are transported. Further, a diverter is included that diverts mailpieces of the first type to the first transport path and mailpieces of the second type to the second transport path.

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Patent Owner(s)

Patent OwnerAddress
PITNEY BOWES INC1 ELMCROFT ROAD STAMFORD CT 06926-0700

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chapman, Carl R Monroe, CT 8 21
Lyga, Thomas M Southbury, CT 47 234

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