Method of making light emitting device with silicon-containing encapsulant
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United States of America Patent
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Sep 23, 2008
Grant Date -
Sep 7, 2006
app pub date -
May 17, 2006
filing date -
Nov 18, 2004
priority date (Note) -
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Abstract
A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition comprising a silicon-containing resin, a metal-containing catalyst, and surface treated particles, the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation, the surface treated particles comprising nonabsorbing metal oxide particles, semiconductor particles, or combinations thereof, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.
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