Repairable three-dimensional semiconductor subsystem
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United States of America Patent
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Sep 23, 2008
Grant Date -
Jun 22, 2006
app pub date -
Dec 16, 2004
filing date -
Dec 16, 2004
priority date (Note) -
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Abstract
A tightly packed three-dimensional electronic system or subsystem comprising multiple stacks of semiconductor elements is described. The system is repairable because the elements connect together using re-workable flip chip connectors; each flip chip connector comprises a conductive spring element on one side and a corresponding well filled with solder on the other side. The spring elements relieve stresses at the interfaces and allow the component stacks to remain flat; they also provide vertical compliance for easing assembly of elements that have been imperfectly thinned or planarized. Semiconductor integration platforms may be used to integrate active and passive devices, multi-layer interconnections, through wafer connections, I/O plugs, and terminals for attachment of other semiconductor elements or cables.
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