Memory package
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United States of America Patent
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-
Sep 30, 2008
Grant Date -
Jun 15, 2006
app pub date -
Jan 25, 2006
filing date -
Mar 28, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated into a microprocessor controlled device or alternatively is integrated into a portable memory card.
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