Molding composition and method, and molded article
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United States of America Patent
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Sep 30, 2008
Grant Date -
Jan 4, 2007
app pub date -
Jun 30, 2005
filing date -
Jun 30, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.
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