Apparatus and method for removing photoresist from a substrate
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United States of America Patent
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Oct 7, 2008
Grant Date -
Dec 30, 2004
app pub date -
Nov 14, 2003
filing date -
Jun 26, 2003
priority date (Note) -
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Abstract
An apparatus and method for removing photoresist from a substrate, which includes treating the photoresist with a first reactant to cause swelling, cracking or delamination of the photoresist, treating the photoresist with a second reactant to chemically alter the photoresist, and subsequently removing the chemically altered photoresist with a third reactant. In one example, the first reactant is supercritical carbon dioxide (SCCO.sub.2), the second reactant is ozone vapor, and the third reactant is deionized water.
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