Etchant, replenishment solution and method for producing copper wiring using the same
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United States of America Patent
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Oct 7, 2008
Grant Date -
Jan 27, 2005
app pub date -
Jul 22, 2004
filing date -
Jul 25, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
An etchant for copper and copper alloys, includes an aqueous solution containing: 14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions; 7 to 180 g/liter of hydrochloric acid; and 0.1 to 50 g/liter of azole, the azole including nitrogen atoms only as heteroatoms residing in a ring. A method for producing a wiring by etching of copper or copper alloys, includes the step of: etching a portion of a copper layer on an electrical insulative member that is not covered with an etching resist using the above-described etchant so as to form the wiring. Thereby, a fine and dense wiring pattern with reduced undercut can be formed.
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