Leadless leadframe package substitute and stack package
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United States of America Patent
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Oct 7, 2008
Grant Date -
Jan 6, 2005
app pub date -
Jul 8, 2004
filing date -
Jan 22, 2003
priority date (Note) -
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Abstract
A semiconductor package is provided with an internal package formed in the cavity of the external leadless leadframe package (LLP). The internal package is a leadless leadframe package and provides a substrate for mounting one or more die and passive devices to form the external LLP. By arranging the die and passive components on the internal package, higher chip density and a smaller form factor may be achieved.
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