Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
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United States of America Patent
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Oct 7, 2008
Grant Date -
Dec 22, 2005
app pub date -
Jun 21, 2004
filing date -
Jun 21, 2004
priority date (Note) -
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Abstract
An apparatus and method for enhancing thermal performance and electromagnetic interference (EMI) shielding in die-up array integrated circuit (IC) device packages is presented. A die-up array package includes an IC die mounted to a first stiffener surface. The package further includes a cap body having first and second surfaces. A first portion of the second surface has a cavity formed therein, and a planar second portion of the second surface is coupled to the first stiffener surface. The package further includes a substrate having a first surface coupled to a second stiffener surface. A plurality of contact pads on the first substrate surface are electrically connected to an array of electrically conductive terminals on a second substrate surface. The stiffener and cap body form a die enclosure that dissipates heat during operation of the IC die, and shields EMI emanating from and radiating toward the IC die.
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