Thermal contact arrangement
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United States of America Patent
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-
Oct 7, 2008
Grant Date -
Apr 5, 2007
app pub date -
Sep 30, 2005
filing date -
Sep 30, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A thermal contact arrangement. The thermal contact arrangement may mitigate or reduce migration over time of a thermal interface material positioned between a chip and a heat sink. The thermal contact arrangement may include a first zone formed on a first area of the heat sink and a second zone formed on a second area of the heat sink. The processor may overlap or overlie the first zone, with the second zone generally outside the footprint of the processor and optionally surrounding the processor's footprint. The first zone may have a generally smooth surface, while the second zone may have a surface rougher than the first zone. The first zone may be finished to a specific smoothness while the second zone may be finished to second particular smoothness that is generally less than the first zone.
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