Polishing fluids and methods for CMP
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United States of America Patent
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Oct 14, 2008
Grant Date -
Apr 26, 2007
app pub date -
Oct 24, 2005
filing date -
Oct 24, 2005
priority date (Note) -
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Abstract
Provided are several polishing compositions useful for modifying a surface, such as a semiconductor wafer suitable for fabrication of a semiconductor device, especially when used in fixed abrasive planarization techniques. The polishing compositions include a synergistic mixture of water, an oxidizing agent, a complexing agent, and metal ions. Also provided are various methods of surface planarization.
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