Method of providing a pre-patterned high-k dielectric film
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United States of America Patent
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Oct 14, 2008
Grant Date -
Jan 3, 2008
app pub date -
Jun 30, 2006
filing date -
Jun 30, 2006
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Abstract
A method of forming a pre-patterned high-k dielectric film onto a support layer. The method includes: providing a support layer; providing a template defining template openings therein exhibiting a pattern that is a mirror image of a pattern of the pre-patterned high-k dielectric film; disposing the template onto the support layer; providing a high-k precursor material inside the template openings; curing the high-k precursor material inside the template openings to yield a cured film; and removing the template from the support layer after curing to leave the cured film on the conductive film.
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