Radio-frequency module for communication
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United States of America Patent
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Oct 14, 2008
Issued Date -
N/A
app pub date -
Jul 25, 2005
filing date -
Mar 9, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.
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