Wafer level packaging structure with inductors and manufacture method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 14, 2008
Grant Date -
Sep 20, 2007
app pub date -
Dec 15, 2006
filing date -
Mar 17, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A wafer level packaging structure with inductors and manufacture method thereof. The method comprises providing a substrate, having several inductors, forming conductive lines and holes to connect the inductors and the wafer, and bonding the substrate and the wafer via bonding pads. Therefore, there are air gaps between the inductors and the wafer, thereby reducing the inductor's dispassion loss and increasing the inductor's quality factor. In addition, the inductors having a high quality factor can be integrated in the wafer containing active/passive components.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully