Substrate based unmolded package
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United States of America Patent
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-
Oct 21, 2008
Grant Date -
Oct 21, 2004
app pub date -
May 6, 2004
filing date -
Aug 30, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a leadframe structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead. The die attach surface and the lead surface can be in different planes.
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