Integrated circuit package-in-package system
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United States of America Patent
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Oct 21, 2008
Grant Date -
Feb 7, 2008
app pub date -
Aug 4, 2006
filing date -
Aug 4, 2006
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An integrated circuit package-in-package system is provided including forming an external interconnect having an upper portion and a lower portion; forming a packaged device; mounting an active device over the packaged device; connecting the active device to the packaged device and the upper portion; and molding the packaged device, the active device, and the upper portion.
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