Capillary imprinting technique
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United States of America Patent
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Oct 28, 2008
Grant Date -
Mar 24, 2005
app pub date -
Aug 21, 2003
filing date -
Aug 21, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides a method for patterning a substrate with a template having a mold that features positioning conformable material between the substrate and the mold and filling a volume defined between the mold and the substrate with the conformable material through capillary action between the conformable material and one of the mold and the substrate. Thereafter, the conformable material is solidified. Specifically, the distance between the mold and the substrate is controlled to a sufficient degree to attenuate, if not avoid, compressive forces between the mold and the substrate. As a result, upon initial contact of the mold with the conformable material, spontaneous capillary filling of the volume between the mold and the substrate occurs.
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