Method of inhibiting copper corrosion during supercritical CO.sub.2 cleaning

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United States of America Patent

PATENT NO 7442636
APP PUB NO 20060228874A1
SERIAL NO

11095827

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Abstract

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A method for the pre-treatment of a wafer substrates with exposed metal surfaces is disclosed. The pre-treatment reduces oxidation of the exposed metal surfaces during subsequent supercritical cleaning processes.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hillman, Joseph Scottsdale, AZ 7 52

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