Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials
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United States of America Patent
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Oct 28, 2008
Grant Date -
Jun 1, 2006
app pub date -
Jan 20, 2006
filing date -
Sep 2, 2004
priority date (Note) -
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Abstract
A conductive element is formed on a substrate by forming an organometallic layer on at least a portion of a surface of the substrate, heating a portion of the organometallic layer, and removing an unheated portion of the organometallic layer. In other methods, a flowable, uncured conductive material may be deposited on a surface of the substrate, the flowable, uncured conductive material may be selectively cured over at least a portion of the surface of the substrate, and a portion of the cured conductive material may be removed. A conductive via is formed by forming a hole at least partially through a thickness of a substrate, depositing an organometallic material within at least a portion of the hole, and selectively heating at least a portion of the organometallic material.
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